My client is looking for a Principal Packaging Engineer, focused on advanced packaging architecture, heterogeneous integration and next-generation semiconductor systems across AI, HPC, RF, power and photonics. This is an opportunity for an Engineer with a strong technical background, and leadership experience, looking to step into a Principal position.
Responsibilities
Architect advanced 2.5D/3D packaging and heterogeneous integration solutions
Lead chiplet, interposer, TSV, high-density interconnect and hybrid bonding development
Take packaging concepts from customer requirements through prototyping, demonstrators and qualification
Define packaging technology roadmaps and drive long-term innovation
Lead multidisciplinary technical projects across design, assembly, thermal and test
Develop advanced microelectronic modules and system demonstrators
Provide technical leadership across design, validation and qualification
Support hands-on prototyping and laboratory development
Contribute to technical proposals, bids and collaborative R&D programmes
Manage technical risks and support technology decisions with customers and partners
Requirements
Strong experience in advanced semiconductor packaging and heterogeneous integration
Expertise in 2.5D/3D packaging, chiplets and advanced assembly
Experience with substrates, interposers, TSVs and/or hybrid bonding
Proven experience leading semiconductor packaging development projects
Understanding of the full packaging lifecycle from design through qualification
Knowledge of signal integrity, power integrity and thermal management
Experience taking R&D concepts through to working prototypes or demonstrators
Strong technical leadership, problem-solving and communication skills
Experience in AI, HPC, telecoms or photonics is desired but not a must
Benefits
Competitive salary + bonus
Sponsorship + Relocation assistance
Company pension
Private healthcare for you and your family
Hybrid working to fit around your schedule
A healthy work environment, with great work life balance
If you are interested, contact Ella Flynn at IC Resources.
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