In this role you will shape advanced packaging architectures for 2.5D/3D integration across AI, HPC, RF, power and photonics. You will lead cross‑functional teams to define roadmaps, prototype and qualify innovative packaging concepts, and drive technical decisions with customers and partners. You’ll oversee multi‑discipline projects from concept to demonstrator, delivering high‑impact microelectronic modules and system demonstrations. This position combines hands‑on prototyping, leadership, and strategic innovation within a collaborative engineering environment.
Pay / Benefits
Competitive salary + bonus
Sponsorship + Relocation assistance
Company pension
Private healthcare for you and your family
Hybrid working to fit around your schedule
Healthy work environment, with great work life balance
Responsibilities
Architect and deliver advanced 2.5D/3D packaging and heterogeneous integration solutions
Lead development of chiplets, interposers, TSVs, high-density interconnects and hybrid bonding
Translate customer requirements into prototyping, demonstrators and qualification programs
Define technology roadmaps and drive long‑term packaging innovation
Lead multidisciplinary projects across design, assembly, thermal and test domains
Develop advanced microelectronic modules and system demonstrators
Provide technical leadership across design, validation and qualification activities
Support hands‑on prototyping and laboratory development
Contribute to technical proposals, bids and collaborative R&D programs
Manage technical risks and guide technology decisions with customers/partners
Key requirements
Strong experience in advanced semiconductor packaging and heterogeneous integration
Expertise in 2.5D/3D packaging, chiplets and advanced assembly
Experience with substrates, interposers, TSVs and/or hybrid bonding
Proven track record leading semiconductor packaging development projects
Understanding of the full packaging lifecycle from design through qualification
Knowledge of signal integrity, power integrity and thermal management
Experience transitioning R&D concepts to working prototypes or demonstrators
Strong technical leadership, problem‑solving and communication skills
Experience in AI, HPC, telecoms or photonics is desirable but not required
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