Director - Hardware Engineering, AI Infrastructure Systems
Remote
Axelera AI is not your regular deep-tech company.
Axelera AI is not your regular deep-tech company. We are creating the next-generation AI platform to support anyone who wants to help advancing humanity and improve the world around us.
In just five years, we have raised a total of $450 million and have built a world-class team of 250+ employees (including 60+ PhDs with more than 40,000 citations), both remotely from 20 different countries and with offices in Belgium, France, Switzerland, Italy, the UK, headquartered at the High Tech Campus in Eindhoven, Netherlands.
We have also launched our Metis™ AI Platform, which achieves a 3-5x increase in efficiency and performance, and have visibility into a strong business pipeline exceeding $100 million.
Our unwavering commitment to innovation has firmly established us as a global industry pioneer.
Are you up for the challenge?
We are looking for an entrepreneurial, technically exceptional engineering leader to establish and run Axelera’s AI Infrastructure Systems division within the AI Integrated Systems (AIS) group. This is a new function, created to realize and deliver our next-generation accelerator silicon into datacenter-class form factors from PCIe accelerator cards and OAM-class modules to full 1U/2U rack systems and dense compute nodes targeting enterprise AI, sovereign cloud and HPC customers.
You will build the team, shape the technical roadmap, and own end-to-end delivery of board- and system-level products for two strategic programmes. You will partner closely with the engineering leadership of the Embedded AI product line within AIS, System and Platform Architecture within R&D, the silicon organisation, the Voyager SDK/software group, and Axelera’s go-to-market teams serving hyperscalers, sovereign AI initiatives and the European HPC ecosystem.
This role is deeply hands-on, owning implementation, validation, and delivery of platform systems. You will review schematics and layouts, challenge power and thermal budgets, shape the BMC and platform-firmware stack, and walk the lab floor during bring-up. Strategic leadership without technical depth will not work here.
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Remote
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