Cryogenic 3D Packaging Lead for Quantum Modules
London
Jobtailor seeks a senior packaging and R&D leader to drive 3D integration for multi-chip quantum modules.
Jobtailor seeks a senior packaging and R&D leader to drive 3D integration for multi-chip quantum modules. You will build and guide a team across packaging, signal integrity, materials, and quantum integration, coordinating with external foundries and research partners to deliver robust, cryogenic-ready solutions.
Your work will balance rapid prototyping with rigorous reliability, yield, and long-term stability, partnering with design, process integration, cryo R&D, and quantum hardware teams.
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London
Jobtailor seeks a senior packaging and R&D leader to drive 3D integration for multi-chip quantum modules.
Daresbury
PsiQuantum’smission is to build the first useful quantum computers—machines capable of delivering the breakthroughs the field has long promised.
Daresbury
PsiQuantum is building the world’s first fault‑tolerant quantum computer and is seeking an Optical Packaging & Assembly Engineer to join our UK R&D…
Daresbury
PsiQuantum’s mission is to build the first useful quantum computers—machines capable of delivering the breakthroughs the field has long promised.
Newport on Tay
In this role you will shape advanced packaging architectures for 2.5D/3D integration across AI, HPC, RF, power and photonics.
Newport
In this role you will shape advanced packaging architectures for 2.5D/3D integration across AI, HPC, RF, power and photonics.
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