Manufacturing Process Engineer (Semiconductors)

Overview

As a Junior Engineer in TT Electronics’ manufacturing team, you support high-reliability microelectronic production for aerospace, automotive, medical, and defence applications. You work with senior engineers, technicians, and QA to optimise wire bonding processes and improve yields. With structured training and close supervision, you’ll help qualify and transfer new packages to production while driving continuous improvement. This role offers hands-on development in a safety‑conscious, collaborative environment with a clear impact on product quality and delivery.

Pay / Benefits

• Competitive Salary
• Enhanced pension contributions
• Healthcare cashback plan
• Employee assistance programme
• Site incentive plan
• 5 weeks annual leave plus bank holidays

Responsibilities

• Monitor, troubleshoot, and optimise wire bonding manufacturing processes
• Apply Six Sigma and SPC tools to analyse production data and implement corrective/preventive actions
• Assist in qualification, prototyping, and transfer of new microelectronic packages from prototype to production
• Support preventive maintenance, setup, and continuous improvement projects
• Create and maintain robust engineering documentation
• Collaborate with Quality Assurance, Test Engineering, and Production to meet customer specifications and delivery schedules

Key requirements

• Bachelor or Master’s degree in Engineering, Materials Science, Chemical Engineering, or related discipline
• Foundational understanding of microelectronics / semiconductor assembly & packaging, or materials science

• Problem solving
• Team collaboration
• Attention to detail
• Six Sigma
• SPC (Statistical Process Control)
• DOE (Design of Experiments) knowledge

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