Director of Semiconductor Packaging

Overview

In this leadership role, you will set and drive the packaging strategy for GaN power devices, shaping high-density, high-performance packages. You will lead a cross-functional team, collaborate with overseas manufacturing partners, and influence roadmap decisions aligned with the company’s growth in advanced power packaging. You will tackle design-for-manufacture, reliability, and thermal challenges to deliver right-first-time solutions. This is a strategic role at scale, blending technical depth with people leadership to advance state-of-the-art packaging. You will work closely with internal teams and external partners to push the technology envelope and impact product performance.

Responsibilities

• Lead design and development of high-performance, high-density packages for GaN power products
• Develop technologies including wirebond, flip-chip, embedded packaging and wafer back-end processes
• Balance electrical, thermal, mechanical, cost, quality and form-factor requirements
• Manage packaging development with overseas assembly houses and technology suppliers
• Support package verification, qualification, reliability and thermal testing
• Drive design-for-manufacture, processes and tools for right-first-time designs
• Conduct first-article inspection and failure analysis
• Provide packaging expertise to Applications Engineering and customers
• Contribute to product and technology roadmap
• Build external networks and stay abreast of state-of-the-art packaging

Key requirements

• Degree or higher in Engineering, Physics, Materials Science or related discipline
• Experience in designing and manufacturing high-volume semiconductor power packages, including overseas assembly houses
• Deep knowledge of packaging technologies: die attach, Ag-sintering, flip-chip, wire bonding, copper clip, PCB embedding, chip metallisation
• Strong 3D CAD experience and knowledge of supplier design rules/DFM
• 3D multiphysics/FEA simulation experience (COMSOL, ANSYS or equivalent)
• Thermal characterization of semiconductor packages
• Package qualification/reliability testing experience (TCoB, MSL, TC, HAST, HTS) against standards
• Cross-functional leadership and supplier-management skills
• Ability to manage priorities independently and deliver results
• Confident presenting technical results to internal and external stakeholders

• cross-functional collaboration
• supplier management
• effective communication
• die attach
• Ag-sintering
• flip-chip

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